Xiaomi unveils in-house chip Xring O3; produced on TSMC's 3nm process
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View chart & analysis → - 1Chinese smartphone maker Xiaomi unveiled its self-designed processor Xring O3 on Monday
- 2According to sources, it is produced on TSMC's 3nm process and will be installed in its next flagship foldable, with a target shipment of 200,000–300,000 units
- 3The successor, coming one year after the launch of O1, is a move to tighten supply-chain control and reduce reliance on external chips
This 3-line summary is compiled from the report below.
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