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Bernstein expects High Bandwidth Flash (HBF) to become a new growth opportunity for the NAND industry

Investing.com · ·by G4L

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  1. 1Bernstein analyzed that HBF capacity is 8 to 16 times larger than High Bandwidth Memory (HBM).
  2. 2Depending on the configuration, HBF manufacturing costs could be 10 times higher than existing enterprise SSD manufacturing costs.
  3. 3SanDisk is proceeding with HBF standardization and initial silicon development, aiming to release the first product samples for inference applications in 2027.

So what's the key point?

Bernstein analyzed that HBF has a much larger capacity than existing memory. SanDisk is preparing this technology with a goal to release products in 2027.

Source Investing.com · View original ↗

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